• DocumentCode
    2798413
  • Title

    Vacuum microfabrication on live fruit fly

  • Author

    Shum, Angela J. ; Parviz, Babak A.

  • Author_Institution
    Univ. of Washington, Seattle
  • fYear
    2007
  • fDate
    21-25 Jan. 2007
  • Firstpage
    179
  • Lastpage
    182
  • Abstract
    The survival rate of Drosophila when exposed to moderate vacuum levels is studied and it is established that the organism can be subjected to 55 mTorr vacuum for periods as long as 70 minutes with a significant rate of survival (>20%). This finding opens a number of new opportunities for performing fabrication processes, similar to the ones performed on a silicon wafer, on a fruit fly as a live substrate. As a model microfabrication process, it is shown how a collection of Drosophila can be made to self-assemble into an array of microfabricated recesses on a silicon wafer and how a shadow mask can be used to thermally evaporate 100 nm of indium on flies. The procedure resulted in the production of a number of live flies with 50 mum indium micro patterns on their wings. The first demonstration of vacuum microfabrication on a live organism provides the first step towards the development of a hybrid biological/solid-state manufacturing process for complex microsystems.
  • Keywords
    biotechnology; indium; masks; micromachining; self-assembly; vacuum deposition; zoology; Drosophila; complex microsystems; fruit fly; hybrid biological-solid-state manufacturing process; indium micro patterns; pressure 55 mtorr; self-assembly; shadow mask; silicon wafer; thermal evaporation; vacuum microfabrication; Embryo; Energy measurement; Fabrication; Indium; Insects; Manufacturing processes; Organisms; Production; Silicon; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
  • Conference_Location
    Hyogo
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-095-5
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2007.4433046
  • Filename
    4433046