DocumentCode
2798749
Title
Fabrication of microchannels with patterned bio-active layers
Author
Iwama, Ryo ; Lee, Lap Man ; Cho, Eung San ; Zohar, Yitshak
Author_Institution
Univ. of Arizona, Tucson
fYear
2007
fDate
21-25 Jan. 2007
Firstpage
333
Lastpage
336
Abstract
Patterns of bio-active coatings on the inner surfaces of microchannels have been realized using a novel low-temperature, UV-epoxy glass-to-silicon bonding technique. Sucrose is applied as a protection layer for the immobilized bio-functional films during the bonding step. The bio-functional layer is composed of antibody patterns, for binding specific targets, next to polyethylene glycol (PEG) coated regions for preventing non-specific absorption. The activity of the patterned bio layer is tested, after the removal of the sucrose protection layer, utilizing fluorescent microscopy. A solution of fluorescent-labelled antigens is injected into the microchannels for incubation with the immobilized antibodies. Upon exposure to proper radiation, light is emitted only from the antibody patterns while the PEG regions remain dark. Hence, the sucrose-protection and UV-bonding techniques have not significantly compromised the functionality of the patterned antibodies, in binding to their counter receptors, and PEG molecules, in preventing non-specific adsorption, at the end of the fabrication process.
Keywords
bonding processes; microchannel flow; PEG regions; UV-bonding techniques; antibody patterns; bio-active coatings; bio-functional layer; bonding step; fluorescent microscopy; fluorescent-labelled antigens; immobilized antibodies; immobilized bio-functional films; low-temperature UV-epoxy glass-to-silicon bonding; microchannel fabrication; nonspecific absorption; patterned bio-active layers; patterned biolayer; polyethylene glycol coated regions; sucrose protection layer; Absorption; Bonding; Coatings; Fabrication; Fluorescence; Microchannel; Polyethylene; Protection; Sugar; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location
Hyogo
ISSN
1084-6999
Print_ISBN
978-1-4244-095-5
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2007.4433066
Filename
4433066
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