DocumentCode
2798891
Title
Damping effects in MEMS resonators
Author
Gologanu, M. ; Bostan, C.G. ; Avramescu, Viorel ; Buiu, Octavian
Author_Institution
Sensors & Wireless Lab. Bucharest (SWLB), Honeywell Romania, SRL, Bucharest, Romania
Volume
1
fYear
2012
fDate
15-17 Oct. 2012
Firstpage
67
Lastpage
76
Abstract
Damping effects are very important in MEMS-based sensors and actuators. In this paper we use analytical models and finite element (FE) computations to quantify the energy losses due to viscous fluid damping, acoustic radiation and thermo-elastic damping. To treat the case where squeeze/slide film models can not be applied, we have implemented in a commercial FE package a new incompressible flow solver based on a gauge formulation. We are thus able to solve for full flows around complex 3D geometries in the frequency domain and predict viscous damping of resonant MEMS structures. The full methodology is exemplified on the response of a MEMS silicon resonator, including acoustic driving and piezoelectric sensing.
Keywords
damping; finite element analysis; frequency-domain analysis; microactuators; microfluidics; micromechanical resonators; microsensors; silicon; thermoelasticity; viscosity; FE computations; MEMS resonators; MEMS silicon resonator; MEMS-based actuators; MEMS-based sensors; acoustic driving; acoustic radiation; analytical models; commercial FE package; complex 3D geometry; damping effects; energy losses; finite element computations; frequency domain; gauge formulation; incompressible flow solver; piezoelectric sensing; resonant MEMS structures; squeeze/slide film models; thermo-elastic damping; viscous fluid damping; Acoustic beams; Acoustics; Damping; Equations; Mathematical model; Micromechanical devices; Vibrations; Damping; MEMS; Modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2012 International
Conference_Location
Sinaia
ISSN
1545-857X
Print_ISBN
978-1-4673-0737-6
Type
conf
DOI
10.1109/SMICND.2012.6400695
Filename
6400695
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