DocumentCode :
2799428
Title :
Micro-tensile tests to characterize MEMS
Author :
Modlinski, Robert ; Puers, Robert ; Wolf, Ingrid De
Author_Institution :
lMEC, Leuven
fYear :
2007
fDate :
21-25 Jan. 2007
Firstpage :
255
Lastpage :
258
Abstract :
Measuring mechanical properties at the microscale is essential to understand and fabricate reliable MEMS. In this paper we present a tensile testing system and test samples on the microscale. The test samples have a dog-bone like structure. They were designed to mimic fundamental and standardized macro-tensile test samples. The micro-tensile tests were used to characterize 1.7mum thick AlCuMgMn films. This alloy was selected because it is a very promising material for use in RF-MEMS switches due to its high resistance to creep. We show that the mechanical properties of the AlCuMgMn film depend not only on the alloying components but also on the material´s microstructure: grain sizes, distribution, strength and density of the precipitates, etc. We show a direct relation between the film´s mechanical properties and the coherence, size and spacing of precipitates as observed by SEM and TEM in the alloy.
Keywords :
aluminium compounds; copper compounds; crystal microstructure; mechanical properties; micromechanical devices; scanning electron microscopy; transmission electron microscopy; AlCuMgMn; MEMS; SEM; TEM; grain sizes; mechanical properties; micro tensile tests; microstructure; size 1.7 mum; Alloying; Creep; Grain size; Mechanical factors; Mechanical variables measurement; Micromechanical devices; Microstructure; Radiofrequency microelectromechanical systems; Switches; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
ISSN :
1084-6999
Print_ISBN :
978-1-4244-095-5
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2007.4433103
Filename :
4433103
Link To Document :
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