Embedded transmission line (ETL) MMIC for low-cost, high-density wireless communication applications

Author

Hua-Quen Tserng ; Saunier, P. ; Ketterson, A. ; Witkowski, L. ; Jones, T.

Author_Institution

Syst. Components Lab., Texas Instrum. Inc., Dallas, TX, USA

fYear

1997

fDate

10-10 June 1997

Firstpage

41

Lastpage

44

Abstract

A new embedded transmission line (ETL) MMIC approach which allows flexibility in mixing different transmission line types (i.e., coplanar and striplines) for maximum MMIC (Monolithic Microwave Integrated Circuits) design flexibility and permits the elimination of back-side processing for low production cost is described. This ETL MMIC approach is an enabling technology allowing for low-cost, batch fabrication, and high-density integration of microwave and RF components (including silicon mixed signal products) for emerging wireless communication applications.

Keywords

MMIC; integrated circuit design; mixed analogue-digital integrated circuits; mobile communication; strip lines; wireless LAN; IC design; MMIC; batch fabrication; coplanar transmission lines; embedded transmission line; high-density integration; high-density wireless communication application; mixed signal products; production cost; striplines; Coplanar transmission lines; Costs; Distributed parameter circuits; Integrated circuit technology; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Production; Stripline; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE

Conference_Location

Denver, CO, USA

Print_ISBN

0-7803-4063-9

Type

conf

DOI

10.1109/RFIC.1997.598738

Filename

598738