Title :
Deep wet etching-through 1mm pyrex glass wafer for microfluidic applications
Author :
Iliescu, Ciprian ; Chen, Bangtao ; Miao, Jianmin
Author_Institution :
Inst. of Bioeng. & Nanotechnol., Singapore
Abstract :
This paper addresses the main issues related to wet micromachining of one of the mostly used BioMEMS materials - glass - and proposes two optimized solutions for deep wet etching. As a result, 500 mum-thick Pyrex glass wafer was etched using an etching mask consisting of low stress amorphous silicon (a: Si) and photoresist. Moreover we report the successful through etching of 1 mm Pyrex glass wafer using a combination of low stress a: Si/SiC/photoresist mask.
Keywords :
amorphous semiconductors; bioMEMS; elemental semiconductors; etching; glass; masks; microfluidics; micromachining; photoresists; silicon; Pyrex glass wafer; Si-SiC; bioMEMS materials; deep wet etching; etching mask; low stress amorphous silicon; microfluidic application; micromachining; photoresist; size 1 mm; Amorphous silicon; Annealing; Biological materials; Glass; Gold; Hafnium; Microfluidics; Resists; Stress; Wet etching;
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
Print_ISBN :
978-1-4244-095-5
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2007.4433150
