Title :
An Explicit Delay Model for On-Chip VLSI RLC Interconnect
Author :
Sahoo, Susmita ; Datta, Madhumanti ; Kar, Rajib
Author_Institution :
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Durgapur, India
Abstract :
On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed, circuit complexity and an increase in interconnect length. In this paper, a novel closed form delay metric has been proposed for the on-chip VLSI RLC interconnect. The model has also been extended for the case when the time of flight of the input signal is comparable. It is started with a distributed RLC line model of the interconnect and analytically solved the resulting diffusion equation for the voltage response and 50% delay has been calculated and has been compared with SPICE delay and error is within 7%. The proposed method also calculates 50% delay by taking the time of flight into consideration and result is compared with SPICE and the average error has been found to be within 6%.
Keywords :
RLC circuits; VLSI; clocks; delay circuits; integrated circuit interconnections; multiprocessor interconnection networks; system-on-chip; SPICE delay; clock speed; closed form delay metric; deep submicron interconnect; diffusion equation; distributed RLC line model; on-chip VLSI RLC interconnect; on-chip inductive effect; time of flight; voltage response; Delay; Equations; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Power transmission lines; Reflection;
Conference_Titel :
Devices and Communications (ICDeCom), 2011 International Conference on
Conference_Location :
Mesra
Print_ISBN :
978-1-4244-9189-6
DOI :
10.1109/ICDECOM.2011.5738480