DocumentCode
2801014
Title
A high efficiency full-chip thermal simulation algorithm
Author
Zhan, Yong ; Sapatnekar, Sachin S.
Author_Institution
Dept. of Electr. & Comput. Eng., Minnesota Univ., USA
fYear
2005
fDate
6-10 Nov. 2005
Firstpage
635
Lastpage
638
Abstract
Thermal simulation has become increasingly important in chip design, especially in the nanometer regime, where the on-chip hot spots severely degrade the performance and reliability of the circuit and increase the leakage power. In this paper, we present a highly efficient and accurate thermal simulation algorithm that is capable of performing full-chip temperature calculations at the cell level. The algorithm is a combination of several important numerical techniques including the Green function method, the discrete cosine transform (DCT), and the frequency domain computations. Experimental results show that our algorithm can achieve orders of magnitude speedup compared with previous Green function based algorithms while maintaining the same accuracy.
Keywords
Green´s function methods; VLSI; discrete cosine transforms; frequency-domain analysis; integrated circuit design; integrated circuit modelling; integrated circuit reliability; thermal management (packaging); Green function method; chip design; circuit performance; circuit reliability; discrete cosine transform; frequency domain computation; full chip thermal simulation; leakage power; on-chip hot spots; Algorithm design and analysis; Chip scale packaging; Circuit simulation; Computational modeling; Discrete cosine transforms; Finite difference methods; Frequency domain analysis; Green function; Signal processing algorithms; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on
Print_ISBN
0-7803-9254-X
Type
conf
DOI
10.1109/ICCAD.2005.1560144
Filename
1560144
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