System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS)

Author

Wang, Janet M. ; Srinivas, Bharat ; Ma, Dongsheng ; Chen, Charlie Chung-Ping ; Li, Jun

Author_Institution

Arizona Univ., Tucson, AZ, USA

fYear

2005

fDate

6-10 Nov. 2005

Firstpage

728

Lastpage

735

Abstract

This paper proposes a new statistical response surface based power estimation technique. The new approach is able to include a number of parameters such as multiple Vdd, multiple Vth and gate sizing parameters. It has both deterministic ability and statistical ability. The deterministic ability allows the new model to provide optimal design parameters for power reduction. The statistical ability can be used to model the process variation impact on power.

Keywords

circuit optimisation; integrated circuit design; integrated circuit technology; nanotechnology; response surface methodology; thermal analysis; thermal management (packaging); gate sizing; orthogonal polynomial; power estimation; power reduction; response surface method; system level power; thermal analysis; thermal modeling; Design optimization; Energy consumption; Fluctuations; Leakage current; Polynomials; Power system modeling; Response surface methodology; Sampling methods; Temperature dependence; Threshold voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on

Print_ISBN

0-7803-9254-X

Type

conf

DOI

10.1109/ICCAD.2005.1560161

Filename

1560161