3D source/drain doping optimization in Multi-Channel MOSFET

We demonstrate that the integration of in-situ doped Si Source and Drain (S/D) in three-dimensional Multi-Channel Field-Effect Transistors (MCFETs) leads to improved electrical performances. The combination of in-situ doped Selective Epitaxial Growth (SEG) and ion implantation indeed enables to drastically reduce the S/D resistance (down to 72 Ω.μm for nFET and 227 Ω.μm for pFET). Ion implantation induces a small mobility degradation, which becomes negligible in short gate length (L_G) MCFETs. Gate width down-scaling otherwise needed to suppress the overall mobility degradation with L_G and obtain the best electrical properties.