• DocumentCode
    2801959
  • Title

    CDMA/FDMA-interconnects for future ULSI communications

  • Author

    Chang, M. Frank

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2005
  • fDate
    6-10 Nov. 2005
  • Firstpage
    975
  • Lastpage
    978
  • Abstract
    Future inter- and intra-ULSI interconnect systems demand extremely high data rates as well as bidirectional multi-I/O concurrent service, reconfigurable computing/processing architecture, and total compatibility with mainstream silicon SOC (system-on-chip) and SIP (system-in-package) technologies. In this talk, we review recent advances in CDMA and FDMA interconnect schemes that promise to meet all of the above system requirements. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and DC power consumption. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next generation computing/processing systems.
  • Keywords
    VLSI; code division multiple access; frequency division multiple access; integrated circuit design; integrated circuit interconnections; reconfigurable architectures; CDMA; DC power consumption; FDMA; SIP; ULSI data communications; baseband noise; bidirectional multi-I/O concurrent service; capacitor couplers; direct-coupled metal wire; extremely high data rate; integrated circuit interconnects; mainstream silicon SOC; reconfigurable computing; reconfigurable processing architecture; system-in-package; system-on-chip; Computer architecture; Concurrent computing; Frequency division multiaccess; Multiaccess communication; Power system interconnection; Power transmission lines; Silicon; System-on-a-chip; Ultra large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2005. ICCAD-2005. IEEE/ACM International Conference on
  • Print_ISBN
    0-7803-9254-X
  • Type

    conf

  • DOI
    10.1109/ICCAD.2005.1560203
  • Filename
    1560203