• DocumentCode
    2801998
  • Title

    Grain boundary-driven leakage path formation in HfO2 dielectrics

  • Author

    Bersuker, G. ; Yum, J. ; Iglesias, V. ; Porti, M. ; Nafría, M. ; McKenna, K. ; Shluger, A. ; Kirsch, P. ; Jammy, R.

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    2010
  • fDate
    14-16 Sept. 2010
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    The time evolution of the leakage current in HfO2 based MIM capacitors under constant voltage stress applied either continuously or with periodic interruptions was studied for a range of stress voltages and temperatures. The data analysis was performed based on the results of the conductive AFM measurements demonstrating preferential current flow along grain boundaries (GB) in the HfO2 dielectric and ab initio calculations, which show the formation of a conductive sub-band due to oxygen vacancy precipitation at GBs. The proposed model suggests that the observed reversible increase in leakage current is caused by the defects segregation at GBs and electron trapping/detrapping at these defects. The energy characteristics of the electrically active defects extracted from the electrical measurements match well with those calculated for neutral oxygen vacancies in hafnia.
  • Keywords
    MIM devices; dielectric devices; leakage currents; HfO2 dielectrics; MIM capacitors; conductive AFM measurements; constant voltage stress; electrical measurements; grain boundaries; grain boundary-driven leakage path formation; leakage current; neutral oxygen vacancies; oxygen vacancy precipitation; preferential current flow; time evolution; Current measurement; Dielectric measurements; Dielectrics; Electron traps; Leakage current; Stress; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2010 Proceedings of the European
  • Conference_Location
    Sevilla
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-6658-0
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2010.5618225
  • Filename
    5618225