Title :
Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.92CH3095-7)
Abstract :
The following topics are dealt with: air cooling; liquid cooling; thermal measurement; thermal analysis and matching; thermal characterization; and analysis and modeling of multichip modules
Keywords :
cooling; integrated circuit technology; modules; packaging; printed circuits; thermal analysis; thermal variables measurement; air cooling; liquid cooling; multichip modules; semiconductor circuits; thermal analysis; thermal characterization; thermal management; thermal matching; thermal measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-0500-0
DOI :
10.1109/STHERM.1992.172841
