• DocumentCode
    2802426
  • Title

    Current sharing of IGBT modules in parallel with thermal imbalance

  • Author

    Wang, Xuesong ; Zhao, Zhengming ; Yuan, Liqiang

  • Author_Institution
    Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2010
  • fDate
    12-16 Sept. 2010
  • Firstpage
    2101
  • Lastpage
    2108
  • Abstract
    For large current, switching devices such as MOSFET and IGBT, often have to be connected in parallel. Due to this reason, derating and preselection of the switching devices become necessary to develop high-power converters. The current imbalance can be produced by stray inductances, device characteristic difference or asymmetric circuit. Moreover, thermal imbalance is another important reason for current balancing. The static and transient characteristics of an IGBT vary sensitively with its junction temperature. This paper focuses on the current sharing of IGBTs in parallel with thermal imbalance. In this paper, an active gate control method which can achieve current balancing of the IGBTs in parallel with thermal imbalance, is explained and verified by experiments. This method can be applied to an actual 160kW/380V power electronics converter prototype for improving the utilization of the switching devices and enhancing system reliability.
  • Keywords
    MOSFET; insulated gate bipolar transistors; power convertors; power electronics; power system reliability; MOSFET; active gate control; asymmetric circuit; current imbalance; high power converters; parallel IGBT modules; power 160 kW; power electronics converter; power system reliability; stray inductance; switching devices; thermal imbalance; voltage 380 V; Insulated gate bipolar transistors; Junctions; Logic gates; Temperature; Temperature control; Temperature measurement; Transient analysis; Converter; IGBT; paralleling; static current balancing; thermal imbalance; transient current balancing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-5286-6
  • Electronic_ISBN
    978-1-4244-5287-3
  • Type

    conf

  • DOI
    10.1109/ECCE.2010.5618253
  • Filename
    5618253