Title :
A comparison of two-dimensional planar, axisymmetric and three-dimensional spreading resistances
Author :
Nelson, D.J. ; Sayers, W.A.
Author_Institution :
Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
Planar and axisymmetric spreading resistances used to predict the peak temperature of semiconductor devices mounted to substrates are given. The results are presented in a nondimensional form for a range of substrate thicknesses relative to device size, device spacing or substrate size relative to device size, and external resistance varying from an isothermal condition up to a uniform heat flux at the base of the substrate. These two-dimensional results are then compared to three-dimensional results for rectangular devices of varying aspect ratio. The comparisons show what conditions are required to accurately approximate three-dimensional problems using two-dimensional models
Keywords :
heat sinks; integrated circuit technology; packaging; temperature distribution; thermal resistance; 2D planar spreading resistance; aspect ratio; axisymmetric spreading resistances; heat sink; isothermal condition; packaging; peak temperature; rectangular devices; semiconductor devices; substrate thicknesses; three-dimensional spreading resistances; uniform heat flux; Heat engines; Heat sinks; Heat transfer; Immune system; Resistance heating; Semiconductor devices; Substrates; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0500-0
DOI :
10.1109/STHERM.1992.172852
