A comparison of two-dimensional planar, axisymmetric and three-dimensional spreading resistances

Author

Nelson, D.J. ; Sayers, W.A.

Author_Institution

Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1992

fDate

3-5 Feb 1992

Firstpage

62

Lastpage

68

Abstract

Planar and axisymmetric spreading resistances used to predict the peak temperature of semiconductor devices mounted to substrates are given. The results are presented in a nondimensional form for a range of substrate thicknesses relative to device size, device spacing or substrate size relative to device size, and external resistance varying from an isothermal condition up to a uniform heat flux at the base of the substrate. These two-dimensional results are then compared to three-dimensional results for rectangular devices of varying aspect ratio. The comparisons show what conditions are required to accurately approximate three-dimensional problems using two-dimensional models

Keywords

heat sinks; integrated circuit technology; packaging; temperature distribution; thermal resistance; 2D planar spreading resistance; aspect ratio; axisymmetric spreading resistances; heat sink; isothermal condition; packaging; peak temperature; rectangular devices; semiconductor devices; substrate thicknesses; three-dimensional spreading resistances; uniform heat flux; Heat engines; Heat sinks; Heat transfer; Immune system; Resistance heating; Semiconductor devices; Substrates; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE

Conference_Location

Austin, TX

Print_ISBN

0-7803-0500-0

Type

conf

DOI

10.1109/STHERM.1992.172852

Filename

172852