DocumentCode
280254
Title
InP based HBT integrated circuits
Author
Topham, P.J. ; Griffith, I. ; Shaw, N
Author_Institution
Plessey Res. Caswell Ltd., Towcester, UK
fYear
1990
fDate
33045
Firstpage
42644
Lastpage
42647
Abstract
Shows InP based bipolar transistors integrated into high performance circuits and their application to an optoelectronic integrated circuit. The motivation for InP based heterojunction bipolar transistors is chiefly for integration with optoelectronic devices operating at the fibre windows of 1.3 and 1.55 μm; in addition InP HBTs offer many of the performance advantages of GaAs HBT circuits but with reduced power consumption (due to the lower bandgap in GaInAsP). The high transconductance, good drive capability, vertical structure and small area requirement of the HBT makes it a natural choice for opto-electronic integration. Further advantages are a short transit time and semi-insulating substrate-which greatly reduces parasitic capacitance and also eases device isolation. The starting point for the process, as with other GaInAsP devices, is the growth of the epitaxial structure by MOCVD. The substrates are 2" diameter semi-insulating InP to allow for device isolation
Keywords
III-V semiconductors; bipolar integrated circuits; chemical vapour deposition; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; integrated circuit technology; integrated optoelectronics; semiconductor epitaxial layers; vapour phase epitaxial growth; 1.3 micron; 1.55 micron; HBT integrated circuits; InP; InP HBTs; InP-GaInAsP; OEICs; drive capability; eases device isolation; fibre windows; heterojunction bipolar transistors; integration with optoelectronic devices; lower bandgap; opto-electronic integration; optoelectronic integrated circuit; performance advantages; reduced power consumption; reduces parasitic capacitance; semi-insulating substrate; semiconductors; short transit time; small area requirement; transconductance; vertical structure;
fLanguage
English
Publisher
iet
Conference_Titel
InP Based Materials, Devices and Integrated Circuits, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
190466
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