• DocumentCode
    2802972
  • Title

    Reliability: A Cross-Disciplinary and Cross-Layer Approach

  • Author

    Wehn, Norbert

  • Author_Institution
    Microelectron. Syst. Design Res. Group, Univ. of Kaiserslautern, Kaiserslautern, Germany
  • fYear
    2011
  • fDate
    20-23 Nov. 2011
  • Firstpage
    496
  • Lastpage
    497
  • Abstract
    Reliability is the next big challenge if CMOS scaling will continue. To solve this challenge, cross-disciplinary approaches become mandatory in which experts from different disciplines like hardware, software, OS and methodology have to cooperate deeply. All levels with appropriate abstractions have to be explored and the scope of the investigations has to be expanded to the application and quality-of-service level.
  • Keywords
    CMOS integrated circuits; integrated circuit reliability; quality of service; scaling circuits; CMOS scaling; cross-disciplinary approach; cross-layer approach; quality-of-service level; reliability; Decoding; Hardware; Iterative decoding; Quality of service; Reliability; Resilience; Signal to noise ratio; Reliability; Turbo Code; Wireless Communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2011 20th Asian
  • Conference_Location
    New Delhi
  • ISSN
    1081-7735
  • Print_ISBN
    978-1-4577-1984-4
  • Type

    conf

  • DOI
    10.1109/ATS.2011.21
  • Filename
    6114723
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2802972