SiGe MMICs and flip-chip MICs for low-cost microwave systems

Author

Case, M.

Author_Institution

Hughes Res. Labs., Malibu, CA, USA

fYear

1997

fDate

10-10 June 1997

Firstpage

117

Lastpage

120

Abstract

Recent Progress in SiGe device technology has improved cutoff frequencies of these devices to beyond 200 GHz. This work describes two approaches for implementing distributed structures with Si substrates: microstrip transmission lines using thick polyimide over a ground plane on the substrate (polyimide MMIC) and small Si devices or chips flip-chip mounted onto a microwave circuit board containing the distributed elements (flip-chip MIC). Microwave circuits such as amplifiers, oscillators, mixers, and frequency dividers have been demonstrated using both techniques.

Keywords

Ge-Si alloys; MMIC amplifiers; MMIC frequency convertors; MMIC mixers; MMIC oscillators; flip-chip devices; frequency dividers; microstrip lines; microwave amplifiers; microwave frequency convertors; microwave integrated circuits; microwave mixers; microwave oscillators; polymer films; MMICs; SiGe; amplifiers; cutoff frequencies; distributed structures; flip-chip MICs; frequency dividers; low-cost microwave systems; microstrip transmission lines; microwave circuit board; mixers; oscillators; polyimide; Cutoff frequency; Distributed parameter circuits; Germanium silicon alloys; MMICs; Microstrip; Microwave devices; Microwave integrated circuits; Polyimides; Printed circuits; Silicon germanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE

Conference_Location

Denver, CO, USA

Print_ISBN

0-7803-4063-9

Type

conf

DOI

10.1109/RFIC.1997.598756

Filename

598756