DocumentCode
2803547
Title
Efficient Use of Unused Spare Columns to Improve Memory Error Correcting Rate
Author
Ishaq, Umair ; Jung, Jihun ; Song, Jaehoon ; Park, Sungju
Author_Institution
Comput. Sci. & Eng., Hanyang Univ., Ansan, South Korea
fYear
2011
fDate
20-23 Nov. 2011
Firstpage
335
Lastpage
340
Abstract
In the deep sub-micron ICs, growing amounts of on-die memory and scaling effects make embedded memories increasingly vulnerable to reliability and yield problems. Spare columns are often included in memories to repair defective cells or bit lines during production test. In many cases, the repair process will not use all spare columns. Schemes have been proposed to exploit these unused spare columns to store additional check bits which can be used to reduce the miscorrection probability for triple errors in single error correction - double error detection (SEC-DED). These additional check bits increase the dimensions of the parity check matrix (H-matrix) requiring extra area and delay overhead. A method is proposed in this paper to efficiently fill the extra rows of the H-matrix on the basis of similarity of logic between the other rows. Optimization of the whole H-matrix is accomplished through logic sharing within a feasible operating time resulting in the reduced area and delay overhead.
Keywords
error correction; error detection; integrated circuit reliability; integrated circuit testing; integrated circuit yield; logic gates; optimisation; scaling circuits; H-matrix; bit lines; deep sub-micron integrated circuit; defective cells; delay overhead; double error detection; embedded memories; logic sharing; memory error correcting rate; miscorrection probability; on-die memory; optimization; parity check matrix; production test; reliability; scaling effects; single error correction; triple errors; unused spare columns; yield problems; Delay; Equations; Error correction codes; Maintenance engineering; Reliability; Vectors; Memory ECC; SEC-DED; logic sharing; misscorrection probability; parity check matrix;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium (ATS), 2011 20th Asian
Conference_Location
New Delhi
ISSN
1081-7735
Print_ISBN
978-1-4577-1984-4
Type
conf
DOI
10.1109/ATS.2011.28
Filename
6114752
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