DocumentCode
2804464
Title
Dynamic electro-thermal modeling in Power Electronics Building Block (PEBB) applications
Author
Wang, Huanhuan ; Khambadkone, Ashwin M. ; Yu, Xiaoxiao
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear
2010
fDate
12-16 Sept. 2010
Firstpage
2993
Lastpage
3000
Abstract
This paper proposes a dynamic electro-thermal methodology via a reasonable iterative algorithm for Power Electronics Building Block (PEBB) application. The modeling includes an improved power loss distribution model which has temperature dependent self-improvement ability and an effective thermal model providing a fast temperature calculation, which can be integrated with electrical model directly. Simulation results are eventually presented to verify the effectiveness of the proposed modeling method in an PEBB application. The proposed dynamic electro-thermal model is proved that it can provide fast and accurate information for shifting PEBBs in their parallel operation and thus improve the PEBB´s efficiency and semiconductor´s life time.
Keywords
iterative methods; losses; power electronics; PEBB application; dynamic electrothermal modeling; fast temperature calculation; iterative algorithm; power electronics building block; power loss distribution model; semiconductor life time; temperature dependent self improvement ability; Heat sinks; Impedance; Insulated gate bipolar transistors; Integrated circuit modeling; Junctions; Mathematical model; Dynamic Electro-Thermal Coupling; Finite Element Method (FEM); Micro Grid; PEBB; Parallel Operation; Power Loss Distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition (ECCE), 2010 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-5286-6
Electronic_ISBN
978-1-4244-5287-3
Type
conf
DOI
10.1109/ECCE.2010.5618360
Filename
5618360
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