Title :
Framework development of an engineering-chain-management-system for the semiconductor industry
Author :
Jonathan ; Yung-Cheng, Chang ; Cheng, Fan-tien
Author_Institution :
Dept. of Manuf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
The engineering chain operation defined in the semiconductor industry results from the considerable engineering work involved in the design cycle of microelectronic devices. Beside supply chain, which supports mass-production operation, the industry needs a robust system and method for coping with IC design risk because of semiconductor manufacturing complexity and operation efficiency among distributed design collaboration resources. This study develops an engineering chain management system (ECMS) for supporting the coherent engineering-chain operations. Based on the functional requirement of engineering chain, a systematic approach is presented for developing an ECMS framework. This framework provides an architecture for system development to support efficient and effective semiconductor engineering-chain operations. The framework has the potential to become a common and practical application for all semiconductor companies, including foundry service and fables companies, and even companies involved in IDM.
Keywords :
CAD/CAM; industrial engineering; integrated circuit design; integrated circuit manufacture; risk management; semiconductor device manufacture; supply chain management; technology CAD (electronics); IC design risk; distributed design collaboration resources; engineering-chain-management-system; foundry service; functional requirement; microelectronic devices design cycle; semiconductor industry; semiconductor manufacturing complexity; supply chain; Brushless DC motors; Collaborative work; Design engineering; Electronics industry; Manufacturing industries; Microelectronics; Robustness; Semiconductor device manufacture; Supply chains; Systems engineering and theory;
Conference_Titel :
Industrial Informatics, 2005. INDIN '05. 2005 3rd IEEE International Conference on
Print_ISBN :
0-7803-9094-6
DOI :
10.1109/INDIN.2005.1560394