Title :
Electrical Performance of Electronic Packaging
Abstract :
The following topics are dealt with: transmission lines; RF and microwave techniques; noise reduction; power distribution; electromagnetic modeling; on chip issues.
Keywords :
electronics packaging; integrated circuit technology; microstrip lines; transmission line theory; RF techniques; electrical performance; electromagnetic modeling; electronics packaging; microwave techniques; noise reduction; on chip issues; power distribution; transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407515
