Parallel plate slot coupler modeling using two dimensional frequency domain transmission line matrix method

Author

Ito, Ryouta

Author_Institution

M-A-COM Inc., Burlington, MA, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

41

Lastpage

44

Abstract

A slot coupler for coupling between via-defined waveguides is analyzed using the 2D frequency domain transmission line matrix (2D-TLM) method. The general 2D-TLM model for a slot coupling between parallel plate waveguides is useful in the design of advanced low cost millimeter-wave packaging. The via waveguide coupler is modeled and the model verified by comparison to measurement.

Keywords

electronics packaging; frequency-domain analysis; parallel plate waveguides; slot line components; transmission line matrix methods; waveguide couplers; waveguide theory; 2D TLM model; millimeter wave packaging; parallel plate slot coupler modeling; parallel plate waveguides; two dimensional frequency domain method; two dimensional transmission line matrix method; via waveguide coupler; waveguide coupler; Coupling circuits; Electromagnetic waveguides; Frequency domain analysis; Geometry; Nonhomogeneous media; Packaging; Phased arrays; Solid modeling; Transmission line matrix methods; Waveguide components;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407541

Filename

1407541