DocumentCode :
2806050
Title :
Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
Author :
Duo, Xirubong ; Zheng, Li-Pang ; Ismail, Mohammed ; Tenhunen, Hannu
Author_Institution :
Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm, Sweden
fYear :
2004
fDate :
25-27 Oct. 2004
Firstpage :
75
Lastpage :
78
Abstract :
Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate the performance of each solution. Analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. Influence of lossy packaging parasitics on LNA is also analyzed.
Keywords :
VLSI; integrated circuit design; integrated circuit noise; integrated circuit packaging; radiofrequency amplifiers; radiofrequency integrated circuits; system-on-chip; RF system; SoC; VLSI; analytical equations; common emitter LNA; common emitter low noise amplifiers; electrostatic discharge; lossy packaging parasitics; noise figure; packaging technologies; system-on-package; Bonding; Capacitance; Equations; Inductance; Inductors; Integrated circuit packaging; Noise figure; Performance analysis; Q factor; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
Type :
conf
DOI :
10.1109/EPEP.2004.1407551
Filename :
1407551
Link To Document :
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