Analysis of lossy packaging parasitics for common emitter LNA in system-on-package

Author

Duo, Xirubong ; Zheng, Li-Pang ; Ismail, Mohammed ; Tenhunen, Hannu

Author_Institution

Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Stockholm, Sweden

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

75

Lastpage

78

Abstract

Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate the performance of each solution. Analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. Influence of lossy packaging parasitics on LNA is also analyzed.

Keywords

VLSI; integrated circuit design; integrated circuit noise; integrated circuit packaging; radiofrequency amplifiers; radiofrequency integrated circuits; system-on-chip; RF system; SoC; VLSI; analytical equations; common emitter LNA; common emitter low noise amplifiers; electrostatic discharge; lossy packaging parasitics; noise figure; packaging technologies; system-on-package; Bonding; Capacitance; Equations; Inductance; Inductors; Integrated circuit packaging; Noise figure; Performance analysis; Q factor; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407551

Filename

1407551