Title :
How detrimental could a via be?
Author :
Shan, Lei ; Kwark, Young ; Dreps, Daniel ; Trewhella, Jean
Author_Institution :
Thomas J. Watson Res. Center, IBM Corp., Yorktown Heights, NY, USA
Abstract :
The vertical interconnects used in printed circuit boards, known as vias, are becoming increasingly critical to interconnect performance with ever increasing system data rates. To explore the effects of vias on system link performance, both simulations and measurements on test structures were implemented in a wide frequency range. The results indicate that proper via management is vital to the success of interconnect designs operating at multi-Gb/s data rates.
Keywords :
interconnections; notch filters; printed circuit design; printed circuits; notch filters; printed circuit boards; system data rates; system link performance; test structures; vertical interconnect design; vias management; Degradation; Geometry; Insertion loss; Integrated circuit interconnections; Packaging; Printed circuits; Reflection; Resonance; Solid modeling; System performance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407555