Title :
A global router for system-on-package targeting layer and crosstalk minimization
Author :
Minz, Jacob R. ; Lim, Sung Kyu
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We formulate and solve a new 3D global routing problem for system-on-package. Our divide-and-conquer algorithm provides an effective way to decompose the complex 3D problem into a set of 2D problems for simultaneous layer and crosstalk minimization.
Keywords :
crosstalk; divide and conquer methods; electronics packaging; minimisation; network routing; 2D problems; 3D global routing problem; crosstalk minimization; divide and conquer algorithm; global router; system on package; Crosstalk; Jacobian matrices; Law; Mechanical factors; Minimization methods; Packaging; Pins; Routing; Runtime; Topology;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407557
