Title :
A fast evaluation of power delivery system input impedance of printed circuit boards with decoupling capacitors
Author :
Zhao, Jin ; Mandhana, Om P.
Author_Institution :
Sigrity Inc., Santa Clara, CA, USA
Abstract :
A fast power delivery system input impedance evaluation methodology for printed circuit board decoupling capacitor placement study is presented in This work. The methodology is based on electrical network admittance matrix properties. The admittance matrix methodology described in This work is rigorously validated by comparing the decoupling capacitor placement evaluation of a real printed circuit board by both impedance matrix and results from commercial electromagnetic field software.
Keywords :
electric admittance; electromagnetic fields; impedance matrix; power capacitors; power supply circuits; printed circuits; admittance matrix methodology; admittance matrix property; decoupling capacitor placement evaluation; electrical network; electromagnetic field software; impedance matrix; input impedance evaluation methodology; power delivery system; printed circuit boards; Admittance; Capacitors; Circuit simulation; Electromagnetic fields; Impedance; Integrated circuit noise; Integrated circuit packaging; Printed circuits; Transmission line matrix methods; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407560
