• DocumentCode
    2806718
  • Title

    Fault coverage estimation model for partially testable multichip modules

  • Author

    Tseng, Wang-Dauh ; Wang, Kuochen

  • Author_Institution
    Dept. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    1997
  • fDate
    15-16 Dec 1997
  • Firstpage
    72
  • Lastpage
    77
  • Abstract
    This paper proposes a simple and efficient model for designers to estimate fault coverage for partially testable MCMs. This model relates fault coverage, test methodology, and the ratio and distribution of DFT dies (dies with design for testability features) in an MCM. Experimental results show that our model can efficiently predict the fault coverage of a partially testable MCM with less than 5% deviation. In addition, the upper bound for fault coverage is also analyzed to guide the designers to know when to stop the effort in planning the use of DFT dies. Two defect level estimation models which relate fault coverage and manufacturing yield for measuring the test quality of MCMs under equiprobable and non-equiprobable faults, respectively, are also presented and evaluated
  • Keywords
    design for testability; electrical engineering computing; integrated circuit testing; multichip modules; defect level estimation models; design for testability; fault coverage; fault coverage estimation model; manufacturing yield; partially testable multichip modules; test methodology; upper bound; Built-in self-test; Circuit faults; Circuit testing; Controllability; Design for testability; Information science; Logic design; Logic testing; Multichip modules; Observability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fault-Tolerant Systems, 1997. Proceedings., Pacific Rim International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    0-8186-8212-4
  • Type

    conf

  • DOI
    10.1109/PRFTS.1997.640128
  • Filename
    640128