DocumentCode
2806776
Title
Electrical validation of source synchronous chip-chip server links at 6.25 Gb/s
Author
Canagasaby, Karthisha S. ; Chaudhuri, Santanu ; Dabral, Sanjay
Author_Institution
Intel Corp., Santa Clara, CA, USA
fYear
2004
fDate
25-27 Oct. 2004
Firstpage
181
Lastpage
184
Abstract
Modeling and validation of 6.25 Gb/s source synchronous backplane links is demonstrated using a correlation methodology. The link model predictions correlate within 10-25% error against scope measured eye and using on-die scope eye when the transmitter output jitter, the interconnect loss and impedance profile and the transmitter equalizer is well modeled and correlated individually. In this paper, the link is assumed to have only transmitted side de-emphasis (equalization). The procedure get additional confidence, when the eye, created from the internal timing and voltage margins, correlates within 10-25% error to the predicted data pad eye. With these a reasonably scalable model over different topologies/speeds that can be used confidently for sensitivity analysis and predictions is obtained.
Keywords
correlation theory; equalisers; jitter; network servers; prediction theory; printed circuit accessories; telecommunication links; transmitters; 6.25 Gbit/s; chip-chip server links; correlation methodology; data pad eye; electrical validation; impedance profile; interconnect losses; jitter; link model predictions; on-die scope eye; sensitivity analysis; source synchronous backplane links; transmitter equalizer; Backplanes; Equalizers; Impedance measurement; Jitter; Loss measurement; Predictive models; Propagation losses; Semiconductor device measurement; Timing; Transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN
0-7803-8667-1
Type
conf
DOI
10.1109/EPEP.2004.1407579
Filename
1407579
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