Power distribution analysis for IBM eServer system integration optimization

Author

Huber, Andreas ; Zhou, Tingdong ; Becker, Wiren D. ; Weekly, Roger ; Klink, Erich

Author_Institution

IBM Corp., Austin, TX, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

189

Lastpage

192

Abstract

Server system design is strongly influenced by power delivery aspects. Multiple requirements and limitations must be taken into consideration. This requires an appropriate DC analysis workflow. This contribution outlines a DC strategy used for IBM eServer design. The strategy is divided into two parts, PrePD and PostPD. PrePD type of analysis is used for system high-level design and optimization including parts selection, number of board layers, module sizing and placement on board, interface pin pattern optimization for both module to board and board to backplane. PostPD analysis is used for first level packaging design optimization and verification. The combination of PrePD and PostPD analysis serves as an efficient and useful tool, shown by the examples of various applications, for server power delivery system design.

Keywords

IBM computers; electronics packaging; network servers; optimisation; power distribution; DC analysis workflow; DC strategy; IBM eServer design; IBM eServer system integration optimization; first level packaging design optimization; first level packaging design verification; interface pin pattern optimization; postphysical deign analysis; power distribution analysis; prephysical deign analysis; server power delivery system design; system high level design; system high level optimization; Connectors; Data mining; Design optimization; Electronics packaging; Gold; Power distribution; Power supplies; Power system modeling; System analysis and design; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407581

Filename

1407581