Title :
Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams
Author :
Ho, Jeffrey C W ; Zhu, Quanyan ; Abhari, Ramesb
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
Abstract :
In this work, data transmission in transmission lines containing textured ground planes in the power distribution network is investigated. A lumped element model is developed to generate eye diagrams and circuit simulations are compared with measurements. A circuit model for a transmission line with an EBG ground plane is introduced. The circuit model for the EBG structure is developed based on using LC components and considering each patch as a parallel-plate transmission line. This modeling strategy allows including two important features to the individual LC stages representing the EBG surface: coupling to the signal line, and transverse loading of adjacent patches in the EBG structure. The circuit model parameters are calculated by using closed-form relations and applying the physical dimensions of the structure-under-test. The proposed model is employed to generate the scattering-parameter graphs and eye diagrams, which are compared with full-wave simulations and measurements to ensure validation of the results in both frequency and time domains.
Keywords :
circuit simulation; data communication; distribution networks; frequency-domain analysis; interference suppression; photonic band gap; time-domain analysis; transmission lines; LC components; circuit model parameters; circuit simulations; closed form relations; data transmission; electromagnetic band gap structure; eye diagrams; frequency domain analysis; full wave simulations; lumped element model; parallel plate transmission line; power distribution network; scattering parameter graphs; structure under test; textured ground planes; time domain analysis; transmission line modeling; Circuit simulation; Coupling circuits; Data communication; Distributed parameter circuits; Metamaterials; Periodic structures; Power systems; Power transmission lines; Transmission line measurements; Transmission lines;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407584