مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2807187

Title :

Foreword

fYear :

2007

fDate :

1-3 Oct. 2007

Keywords :

Assembly; Circuits; Energy management; Environmental management; Packaging machines; Paper technology; Supply chain management; Technology management; Thermal management; Thermal management of electronics;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International

Conference_Location :

Taipei, Taiwan

Print_ISBN :

978-1-4244-1637-0

Electronic_ISBN :

978-1-4244-1637-0

Type :

conf

DOI :

10.1109/IMPACT.2007.4433554

Filename :

4433554

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2807187