Fine pitch “NCF-type compliant-bumped COG”

Author

An, Chao-Chyun ; Chang, Shyh-Ming ; Chen, Ming-Yao ; Kao, Kuo-Shu ; Tsang, Jimmy ; Yang, Sheng-Shu ; Chen, Chih ; Lin, Chung-Kuang ; Chen, Ren-Haw ; Chen, Wen-Chih

Author_Institution

Display Technol. Center, Hsinchu

fYear

2007

fDate

1-3 Oct. 2007

Firstpage

14

Lastpage

17

Abstract

Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump stress and bump deformation are used to identify the environmental temperature range for the given COG bonding structure. Both of the calculation and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress, high bump deformation and low as well as stable connection resistance at various environmental temperatures. The 1,000 hrs 85degC/85%RH reliability test result will be indicated.

Keywords

electrodes; fine-pitch technology; integrated circuit bonding; integrated circuit interconnections; COG bonding structure; IC chip; IC electrode; binding force; bump stress; chip-on-glass bonding method; compressive stress; electrical connections; environmental temperature range; fine pitch NCF-type compliant-bumped COG; glass substrate electrode; high bump deformation; micro-order direct bonding; nonconductive-film; time 1000 hr; Bonding; Compressive stress; Electrodes; Glass; Liquid crystal displays; Materials science and technology; Substrates; Temperature; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International

Conference_Location

Taipei

Print_ISBN

978-1-4244-1636-3

Electronic_ISBN

978-1-4244-1637-0

Type

conf

DOI

10.1109/IMPACT.2007.4433558

Filename

4433558