Open top mold package technology for wide range frequency optical sensors

Organic land chip carrier (OLCC) has long been used for package of CMOS sensors. Typically, OLCC packages are developed in structure, using materials such as organic substrate; UV epoxy, silver paste and antireflection coating (ARC) filter. These packages are able to pass MSL-3 at 260degC test and work well with current red light laser applications. However, this design now has been challenged by use the new blue-ray laser lighting. While doing testing show that the energy of blue-ray laser could vaporize materials inside the package and produce residuals to contaminate CMOS device. A package with new design and construction thus is required to be developed to prevent such contamination. This paper suggests a series of new open top mold package structure that can be used to solve this problem. Details of structures as well as possible manufacturing processes and applications for these packages method are discussed and compared to others in the paper.