Packaging requirements [avionics]

The proposed modular avionics packaging scheme includes a range of digital, bus structured modules together with interface and power supply modules. The rack assembly is likely to be a complete Faraday cage structure providing the first line environmental protection against electromagnetic hazard (EMH), moisture and fluids but only offering minimal protection against the basic mechanical environment. Conducted EMH protection would be incorporated within the rack which should, ideally, allow for backplane removal through the front cover aperture. Input, output and power supply connectors should only be positioned at the ends of the rack such that the front cover can provide the maximum protection for the `active´ modules. Each module within the avionics fit is likely to incorporate one or more card assemblies manufactured with surface mount technology (SMT) components on both sides of a centrally mounted connector and heatsink rib