Methodology for expedient computation of semiconductor substrate noise coupling

A fast semi-analytical modeling methodology is proposed, for expedient computation of semiconductor substrate coupling between substrate contacts. The expediency of the method stems from its ability to calculate analytically the transfer resistance between two contacts for the case of a layered substrate. These transfer resistances are then used for the computation of a conductance matrix representation of the coupling between the contacts. The validity and accuracy of the proposed model are investigated through a series of numerical studies involving semiconductor substrates of properties pertinent to state-of-the-art ICs.