Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects

Author

Shinh, Gurpreet ; Nakhla, Natalie ; Achar, Ram ; Nakhla, Michel ; Dounavis, Anestis ; Erdin, Ihsan

Author_Institution

Carleton Univ., Ottawa, Ont., Canada

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

277

Lastpage

280

Abstract

This work presents a SPICE macromodel for fast transient analysis of lossy multiconductor transmission line (MTL) interconnects in the presence of electromagnetic interference (EMI). A simplified formulation based on split representation at both ends of the MTL structure for computation of equivalent sources in the time-domain is described. A passive and compact macromodel based on delay extraction and closed-form representation is used to describe the distributed nature of the MTL stamp. The proposed algorithm, while guaranteeing the stability of the simulation by employing passive macromodels, provides significant speed-up for EMI analysis of transmission line networks, especially with large delay and low losses.

Keywords

SPICE; electromagnetic interference; integrated circuit interconnections; integrated circuit packaging; multiconductor transmission lines; time-domain analysis; transient analysis; transmission line theory; EMI analysis; SPICE macromodel; closed form representation; delay extraction; electromagnetic interference; electronic packages; high speed interconnects; lossy multiconductor transmission line interconnects; passive macromodels; time domain analysis; transient analysis; transmission line networks; Computational modeling; Delay; Electromagnetic interference; Electronics packaging; Multiconductor transmission lines; Propagation losses; SPICE; Stability analysis; Time domain analysis; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407609

Filename

1407609