Title :
Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives
Author :
Wu, Hong ; Cangellaris, Andreas C. ; Kuo, An-Yu
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.
Keywords :
circuit complexity; digital integrated circuits; finite element analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; mixed analogue-digital integrated circuits; broadband electromagnetic modeling; digital integrated circuits; domain decomposition methodology; electronics packages; finite element electromagnetic modeling; high speed integrated circuits; integrated passives; mixed signal integrated circuits; modeling complexity; multilayer signal wiring environment; planar multilayered interconnect structures; Band pass filters; Electromagnetic analysis; Electromagnetic modeling; Electronics packaging; Finite element methods; Integrated circuit interconnections; Integrated circuit packaging; Metallization; Signal design; Signal processing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407610
