Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives

Author

Wu, Hong ; Cangellaris, Andreas C. ; Kuo, An-Yu

Author_Institution

Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

281

Lastpage

284

Abstract

A domain-decomposition assisted finite element modeling methodology is implemented for broadband electromagnetic modeling of multilayered interconnects and integrated passives. The proposed methodology is aimed at tackling the modeling complexity of the high-density multi-layer signal wiring environment encountered in state-of-the-art packages for high-speed digital and mixed-signal integrated circuits.

Keywords

circuit complexity; digital integrated circuits; finite element analysis; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; mixed analogue-digital integrated circuits; broadband electromagnetic modeling; digital integrated circuits; domain decomposition methodology; electronics packages; finite element electromagnetic modeling; high speed integrated circuits; integrated passives; mixed signal integrated circuits; modeling complexity; multilayer signal wiring environment; planar multilayered interconnect structures; Band pass filters; Electromagnetic analysis; Electromagnetic modeling; Electronics packaging; Finite element methods; Integrated circuit interconnections; Integrated circuit packaging; Metallization; Signal design; Signal processing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407610

Filename

1407610