• DocumentCode
    2807650
  • Title

    Implementation of low jitter clock distribution using chip-package hybrid interconnection

  • Author

    Ryu, Chunghyun ; Chung, Daehyun ; Bae, KiCheol ; Yu, Jiheon ; Kim, Joungho

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2004
  • fDate
    25-27 Oct. 2004
  • Firstpage
    291
  • Lastpage
    294
  • Abstract
    As the clock frequency of digital systems goes higher up to multi-GHz, it is getting more important to distribute the clock signal to each destination with minimum timing jitter as not to exceed the timing margin of the system. For the lossy characteristic of on-chip interconnection lines, repeaters are indispensable to distribute the clock signal on a chip and the number of repeaters is increasing as clock frequency goes up for reliable signal quality. However, these kinds of repeaters can cause timing jitter on the clock signal when they are affected by power supply noise which is usually generated by logic core operation. This work shows a possible solution for the problem, that is, chip-package hybrid interconnection by which some repeaters are no longer necessary and verifies that the hybrid interconnection reduces clock jitter dramatically through implementation and measurement.
  • Keywords
    chip scale packaging; clocks; digital systems; integrated circuit interconnections; repeaters; system-on-chip; timing jitter; chip package hybrid interconnection; clock frequency; clock signal distribution; digital systems; logic core operation; low jitter clock distribution; on-chip interconnection lines; power supply noise; repeaters; signal quality; timing jitter; timing margin; Clocks; Digital systems; Frequency; Noise generators; Power generation; Power supplies; Power system interconnection; Power system reliability; Repeaters; Timing jitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
  • Print_ISBN
    0-7803-8667-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2004.1407614
  • Filename
    1407614