Warpage measurement of ACF-bonded COG package in TFT-LCD after manufacturing and under hydrothermal loads

Author

Tsai, M.Y. ; Huang, C.Y. ; Ting, C.W. ; Kuo-Shu Kao ; Ming-Yao Chen

Author_Institution

Chang Gung Univ., Taoyuan

fYear

2007

fDate

1-3 Oct. 2007

Firstpage

106

Lastpage

109

Abstract

The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded COG packages and thin COG packages(with 0.2 mm substrate) with two kinds of ACFs (ACF-1 from Hitachi; ACF-2 from Sony) in TFT-LCD after bonding fabrication, thermal shock and 85degC/85%RH conditions were measured by full-field Twyman-Green interferometry with a sensitivity of 0.316 mum/fringe. The full- field warpages (or coplanarity) of ACF-bonded COG packages after bonding, hygro-thermal and thermal cyclic conditions have been documented and discussed in details.

Keywords

bonding processes; electronics packaging; glass; interferometry; liquid crystal displays; thin film transistors; Mura effect; Twyman-Green interferometry; anistropic conductive film bonding; chip on glass package; hydrothermal loads; hygro-thermal condition; thermal cyclic condition; thin film transistor-liquid crystal display manufacturing; warpage measurement; Bonding; Electric shock; Glass; Liquid crystal displays; Manufacturing; Optical interferometry; Optical surface waves; Packaging; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International

Conference_Location

Taipei

Print_ISBN

978-1-4244-1636-3

Electronic_ISBN

978-1-4244-1637-0

Type

conf

DOI

10.1109/IMPACT.2007.4433578

Filename

4433578