DocumentCode :
2807692
Title :
Low-frequency noise characteristics of self-aligned AlGaAs/GaAs HBTs with a noise corner frequency below 3 kHz
Author :
Jin-Ho Shin ; Jiyoung Kim ; Yujin Chung ; Joonwoo Lee ; Kyu Hwan Ahn ; Bumman Kim
Author_Institution :
Dept. of Electr. & Electron. Eng., POSTECH, Kyung-Pook, South Korea
fYear :
1997
fDate :
10-10 June 1997
Firstpage :
185
Lastpage :
188
Abstract :
We have investigated the surface recombination and its 1/f noise properties of AlGaAs/GaAs HBTs as a function of the emitter-base structure and the surface passivation condition. It is found that the surface recombination 1/f noise can be significantly reduced by the heterojunction launcher of the abrupt junction with 30% Al mole fraction emitter. The depleted AlGaAs ledge surface passivation further suppresses the surface recombination currents. Consequently, we have achieved a very low 1/f noise corner frequency of 2.8 kHz at the collector current density of 10 kA/cm/sup 2/. The dominant noise source of the HBT is not a surface recombination current, but a bulk current noise. This is the lowest 1/f noise corner frequency among the III-V compound semiconductor devices, and comparable to those of low-noise Si BJTs.
Keywords :
1/f noise; III-V semiconductors; aluminium compounds; characteristics measurement; gallium arsenide; heterojunction bipolar transistors; passivation; semiconductor device noise; surface recombination; 1/f noise properties; 2.8 kHz; AlGaAs-GaAs; III-V semiconductors; bulk current noise; collector current density; emitter-base structure; heterojunction launcher; ledge surface passivation; low-frequency noise characteristics; noise corner frequency; self-aligned HBTs; surface passivation condition; surface recombination; Current density; Frequency; Gallium arsenide; Heterojunction bipolar transistors; III-V semiconductor materials; Low-frequency noise; Noise reduction; Passivation; Radiative recombination; Semiconductor device noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-4063-9
Type :
conf
DOI :
10.1109/RFIC.1997.598779
Filename :
598779
Link To Document :
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