• DocumentCode
    2807692
  • Title

    Low-frequency noise characteristics of self-aligned AlGaAs/GaAs HBTs with a noise corner frequency below 3 kHz

  • Author

    Jin-Ho Shin ; Jiyoung Kim ; Yujin Chung ; Joonwoo Lee ; Kyu Hwan Ahn ; Bumman Kim

  • Author_Institution
    Dept. of Electr. & Electron. Eng., POSTECH, Kyung-Pook, South Korea
  • fYear
    1997
  • fDate
    10-10 June 1997
  • Firstpage
    185
  • Lastpage
    188
  • Abstract
    We have investigated the surface recombination and its 1/f noise properties of AlGaAs/GaAs HBTs as a function of the emitter-base structure and the surface passivation condition. It is found that the surface recombination 1/f noise can be significantly reduced by the heterojunction launcher of the abrupt junction with 30% Al mole fraction emitter. The depleted AlGaAs ledge surface passivation further suppresses the surface recombination currents. Consequently, we have achieved a very low 1/f noise corner frequency of 2.8 kHz at the collector current density of 10 kA/cm/sup 2/. The dominant noise source of the HBT is not a surface recombination current, but a bulk current noise. This is the lowest 1/f noise corner frequency among the III-V compound semiconductor devices, and comparable to those of low-noise Si BJTs.
  • Keywords
    1/f noise; III-V semiconductors; aluminium compounds; characteristics measurement; gallium arsenide; heterojunction bipolar transistors; passivation; semiconductor device noise; surface recombination; 1/f noise properties; 2.8 kHz; AlGaAs-GaAs; III-V semiconductors; bulk current noise; collector current density; emitter-base structure; heterojunction launcher; ledge surface passivation; low-frequency noise characteristics; noise corner frequency; self-aligned HBTs; surface passivation condition; surface recombination; Current density; Frequency; Gallium arsenide; Heterojunction bipolar transistors; III-V semiconductor materials; Low-frequency noise; Noise reduction; Passivation; Radiative recombination; Semiconductor device noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 1997., IEEE
  • Conference_Location
    Denver, CO, USA
  • Print_ISBN
    0-7803-4063-9
  • Type

    conf

  • DOI
    10.1109/RFIC.1997.598779
  • Filename
    598779