DocumentCode :
2807728
Title :
Novel approach for a non-etching adhesion promoter for the next generation of IC substrates
Author :
Brooks, Patrick ; Kumashiro, Shingo ; Terauchi, Koichiro
Author_Institution :
Atotech Deutschland GmbH, Berlin
fYear :
2007
fDate :
1-3 Oct. 2007
Firstpage :
115
Lastpage :
118
Abstract :
Targeted for meeting the requirements of advanced IC manufactures for a non-etching adhesion promoter (NEAP) in the manufacture of sub 10/10 mum line and space, the Securetrade HFz process represents an innovative approach to enhancing the bonding of Ajinomoto buildup film (ABF) materials and comparable films as well as solder masks while not significantly etching the copper conductor to promote adhesion but rather using Silane based chemical adhesion promoters. A complete description of the process and its operating parameters will be presented. As this technical paper will demonstrate, this process achieves superior bonding strength and thermal reliability for not only ABF materials but also high-performance substrates and prepregs in comparison to more traditional copper roughening treatment methods. A complete process characterization has been done to illustrate the merits of Securetrade HFz. The surface was characterized using scanning electron microscopy (SEM), laser interference microscopy (LIM), and atomic force microscopy (AFM) techniques. While the adhesion and thermal performance was done using standard industrial methods such as peel strength.
Keywords :
adhesion; atomic force microscopy; films; integrated circuit manufacture; scanning electron microscopy; substrates; thermal properties; AFM; Ajinomoto buildup film material; IC substrates; LIM; SEM; Secure HFz process; atomic force microscopy; bonding strength; laser interference microscopy; nonetching adhesion promoter; peel strength; prepregs; scanning electron microscopy; thermal reliability; Adhesives; Atomic force microscopy; Bonding; Conducting materials; Conductive films; Copper; Etching; Manufacturing processes; Scanning electron microscopy; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
Type :
conf
DOI :
10.1109/IMPACT.2007.4433580
Filename :
4433580
Link To Document :
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