• DocumentCode
    2807766
  • Title

    Injection Molding and Warpage of Thin-Walled Parts Based on Simulated Deformation

  • Author

    Cheng, X.M. ; Zhou, L. ; Sheng, N.Y. ; Wu, Y.D.

  • Author_Institution
    Sch. of Mech. Eng., Ningbo Univ. of Technol., Ningbo, China
  • fYear
    2009
  • fDate
    11-13 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Injection molding of the typical thin-walled parts, named back cap door of cars, has been systematically investigated. We have focused on the relationship between the injection molding process and warpage, by designing the casting and cooling systems and tailoring the processing parameters based on the simulated analysis of MOLDFLOE software. The optimized processing parameters have been achieved by the compared investigation of the warpage with different gates, the freezing and casting time, the shear to the mold, and the maximum flow pressure. Based on the analysis of the warpage under different mold and flux temperatures, it is found that the former one has little influence, while the latter one exhibits a profound effect on the warpage of the manufactured parts. Finally, some manners have been proposed to reduce the warpage of the thin-walled parts.
  • Keywords
    casting; cooling; injection moulding; plastic deformation; plastic products; production engineering computing; thin wall structures; MOLDFLOE software; back cap door; cars; casting systems; cooling systems; injection molding process; manufactured parts; plastic products; simulated deformation; thin-walled part warpage; Analytical models; Casting; Cooling; Deformable models; Injection molding; Manufacturing; Plastics; Residual stresses; Temperature; Thin wall structures;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Intelligence and Software Engineering, 2009. CiSE 2009. International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-4507-3
  • Electronic_ISBN
    978-1-4244-4507-3
  • Type

    conf

  • DOI
    10.1109/CISE.2009.5362816
  • Filename
    5362816