Title :
Block partitioned Gauss-Seidel PEEC solver accelerated by QR-based coupling matrix compression techniques
Author :
Ruehli, Albert ; Gope, Dipanjan ; Jandhyala, Vikram
Author_Institution :
IBM Res. Div., Yorktown Heights, NY, USA
Abstract :
Electromagnetic (EM) integral equation solvers based on the partial element equivalent circuit (PEEC) approach have proven to be well suited for modeling combined circuit and EM problems. The solution of the full-wave electromagnetic part is transformed to the circuit domain and general well-known circuit solver techniques are applied. However owing to the mutual couplings in the PEEC formulation, the MNA matrix is not sparse as in the case of general lumped circuits. This gives rise to a time and memory bottleneck. A Gauss-Seidel relaxation (GSR) solver is presented as an appropriate alternative to SPICE sparse LU solvers, for the PEEC class of problems in the frequency domain. Circuit based block partitioning schemes similar to the ones used in waveform relaxation methods with known convergence properties are used to insure fast convergence. Furthermore, circuit coupling thinning schemes based on QR compression techniques are used to accelerate the inter block updates and also intra block solutions.
Keywords :
SPICE; electromagnetic coupling; equivalent circuits; integral equations; integrated circuit modelling; iterative methods; matrix algebra; Gauss-Seidel relaxation solver; LU solvers; MNA matrix; QR based coupling matrix compression; SPICE; circuit based block partitioning method; circuit coupling thinning method; circuit modeling; convergence properties; electromagnetic integral equation solvers; frequency domain analysis; lumped circuits; mutual couplings; partial element equivalent circuit solver; waveform relaxation methods; Acceleration; Coupling circuits; Electromagnetic modeling; Equivalent circuits; Frequency domain analysis; Gaussian processes; Integral equations; Mutual coupling; SPICE; Sparse matrices;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN :
0-7803-8667-1
DOI :
10.1109/EPEP.2004.1407624