DocumentCode
2807902
Title
Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations
Author
Gope, Dipanjan ; Ruehli, Albert ; Jandhyala, Vikram
Author_Institution
Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
fYear
2004
fDate
25-27 Oct. 2004
Firstpage
329
Lastpage
332
Abstract
The partial element equivalent circuit (PEEC) formulation is an integral equation based approach for the solution of combined circuit and electromagnetic (EM) problems. In This work, a surface-based PEEC formulation is presented as an alternative to the existing volume-based method. With the rise in the operating frequencies and the increasing complexity of test structures on boards, packages and chips, a surface based formulation is more efficient for many problems in terms of the number of unknowns generated. The composite conductor dielectric modeling is based on the PMCHWT formulation which is transformed into a PEEC representation using equivalent magnetic and electric circuits connected by mutual coupling. We are interested in both time and frequency domain analyses similar to a SPICE type circuit solver.
Keywords
SPICE; chip scale packaging; circuit simulation; conductors (electric); dielectric materials; electromagnetic coupling; electronics packaging; equivalent circuits; frequency-domain analysis; integral equations; integrated circuit packaging; time-domain analysis; SPICE type circuit solver; conductor dielectric modeling; electromagnetic circuit simulations; equivalent electric circuits; equivalent magnetic circuits; frequency domain analysis; integral equation; mutual coupling; surface based partial element equivalent circuit; time domain analysis; volume based method; Circuit simulation; Circuit testing; Conductors; Dielectrics; Electromagnetic modeling; Equivalent circuits; Frequency domain analysis; Integral equations; Magnetic domains; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
Print_ISBN
0-7803-8667-1
Type
conf
DOI
10.1109/EPEP.2004.1407625
Filename
1407625
Link To Document