• DocumentCode
    2807902
  • Title

    Surface-based PEEC formulation for modeling conductors and dielectrics in time and frequency domain combined circuit electromagnetic simulations

  • Author

    Gope, Dipanjan ; Ruehli, Albert ; Jandhyala, Vikram

  • Author_Institution
    Dept. of Electr. Eng., Washington Univ., St. Louis, MO, USA
  • fYear
    2004
  • fDate
    25-27 Oct. 2004
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    The partial element equivalent circuit (PEEC) formulation is an integral equation based approach for the solution of combined circuit and electromagnetic (EM) problems. In This work, a surface-based PEEC formulation is presented as an alternative to the existing volume-based method. With the rise in the operating frequencies and the increasing complexity of test structures on boards, packages and chips, a surface based formulation is more efficient for many problems in terms of the number of unknowns generated. The composite conductor dielectric modeling is based on the PMCHWT formulation which is transformed into a PEEC representation using equivalent magnetic and electric circuits connected by mutual coupling. We are interested in both time and frequency domain analyses similar to a SPICE type circuit solver.
  • Keywords
    SPICE; chip scale packaging; circuit simulation; conductors (electric); dielectric materials; electromagnetic coupling; electronics packaging; equivalent circuits; frequency-domain analysis; integral equations; integrated circuit packaging; time-domain analysis; SPICE type circuit solver; conductor dielectric modeling; electromagnetic circuit simulations; equivalent electric circuits; equivalent magnetic circuits; frequency domain analysis; integral equation; mutual coupling; surface based partial element equivalent circuit; time domain analysis; volume based method; Circuit simulation; Circuit testing; Conductors; Dielectrics; Electromagnetic modeling; Equivalent circuits; Frequency domain analysis; Integral equations; Magnetic domains; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on
  • Print_ISBN
    0-7803-8667-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2004.1407625
  • Filename
    1407625