• DocumentCode
    2807950
  • Title

    The phase transition & breakdown characteristics of SF6 in temperature decline

  • Author

    Park, Herie ; Choi, Eun-Hyuck ; Do, Young-Hoe ; Kim, Jung-Bae ; Lee, Kwang-Sik

  • Author_Institution
    Dept. of Electr. Eng., Yeungnam Univ., GyungSan
  • fYear
    2008
  • fDate
    June 30 2008-July 3 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper we use SF6 gas(GSF6) according to a surrounding temperature and are research to clarify the reason of GIS (Gas Insulated Switchgear) of the malfunction. The experiments of breakdown characteristics by temperature & pressure change of GSF6, and SF6 liquid (LSF6) in model GIS are described. From the experimentpsilas results, the breakdown characteristics 3-Pattern are classified the vapor stage of SF6 according to Paschenpsilas law, in which the gas & liquid coexisted stage of breakdown voltage (VB) increases, resulting in much deviation and the VB low stage as the interior of the chamber gets filled with a mixture of SF6 that is not liquefacted and remaining air that can not be ventilated. The ability of LSF6 insulation is higher than the high-pressurized SF6 gas. Authors interpreted the 3-Patterns to the experimental and we clarify the reason of the GIS of the malfunction.
  • Keywords
    electric breakdown; gas insulated switchgear; phase transformations; sulphur compounds; GIS; Paschen law; SF6; breakdown characteristics; gas insulated switchgear; phase transition; temperature decline; vapor stage; Breakdown voltage; Electric breakdown; Electrodes; Gas insulation; Geographic Information Systems; Shape; Sulfur hexafluoride; Superconducting transition temperature; Switchgear; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dielectric Liquids, 2008. ICDL 2008. IEEE International Conference on
  • Conference_Location
    Futuroscope-Chasseneuil
  • Print_ISBN
    978-1-4244-1585-4
  • Electronic_ISBN
    978-1-4244-1586-1
  • Type

    conf

  • DOI
    10.1109/ICDL.2008.4622496
  • Filename
    4622496