• DocumentCode
    2808097
  • Title

    First-principles calculations of elastic properties of Cu-Sn crystalline phases

  • Author

    Chen, Jiunn ; Lai, Yi-Shao ; Yang, Ping-Feng

  • fYear
    2007
  • fDate
    1-3 Oct. 2007
  • Firstpage
    193
  • Lastpage
    196
  • Abstract
    Elastic properties of a solid are closely related to many fundamental solid-state properties. Theoretical calculations on elastic constants are well motivated by the advance in computational technologies, especially when mechanical testing on submicron components is extremely difficult. Elastic constants of a number of anisotropic lattice systems have been calculated based on the density functional theory, and good agreements between computational and experimental results have been found. In this study, we report elastic properties of the Cu-Sn crystalline phases, the epsiv-Cu3Sn and eta-Cu6Sn5, using first-principles calculations. The polycrystalline moduli obtained using the Voigt-Reuss scheme are 134.16 GPa for Cu3Sn and 125.98 GPa for Cu6Sn5. The calculation results show these Cu- Sn crystalline phases have the greatest stiffness along the c direction. In particular, the results reveal the unique anisotropic feature along a and b directions within the Cu3Sn superstructure, which cannot be resolved from experiments. Our results also suggest that the least stiffness in the long-period direction is associated with the lattice modulation within the Cu3Sn superstructure.
  • Keywords
    copper compounds; elastic constants; mechanical testing; tin compounds; Voigt-Reuss scheme; anisotropic lattice systems; crystalline phases; density functional theory; elastic constants; first-principles calculations; lattice modulation; mechanical testing; solid-state properties; submicron components; Aging; Anisotropic magnetoresistance; Annealing; Casting; Crystallization; Lattices; Mechanical factors; Packaging; Solid state circuits; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1636-3
  • Electronic_ISBN
    978-1-4244-1637-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2007.4433599
  • Filename
    4433599