Title :
Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge
Author :
Lai, Yi-Shao ; Chang, Hsiao-Chuan ; Chiu, Ying-Ta ; Yeh, Chang-Lin ; Song, Jenn-Ming
Author_Institution :
Adv. Semicond. Eng., Inc., Kaohsiung
Abstract :
In this work, we present ball impact test (BIT) results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu- 0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.
Keywords :
ball grid arrays; copper alloys; impact testing; reflow soldering; silver alloys; solders; tin alloys; Ge; Ni; Sn-Ag-Cu; ball impact testing; direct solder on pad; immersion tin surface finishes; multi-reflow soldering; solder joints; substrate pads; Bonding; Force measurement; Materials science and technology; Materials testing; Packaging; Soldering; Surface finishing; System testing; Tin; Velocity measurement;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1636-3
Electronic_ISBN :
978-1-4244-1637-0
DOI :
10.1109/IMPACT.2007.4433600
