A novel packaging process for open-channel sensors

A novel plastic packaging structure for open-channel sensor was demonstrated using wafer-barrier-forming process in this paper. Stacking SU-8 100 and SU-8 50 photoresists were patterned to form a square and annular barrier to release an open sensing space within the sensor packaging. The annular barrier of 150 mum thickness has been lithographed with good reproducibility using double coating processes. The nearly straight and vertical sidewall profile of barrier was achieved by optimized lithography parameters. Finally, mounting chips on 10 x 10 substrate panel and forming barriers in one process could improve the packaging throughput up to 5 times comparing to traditional one-after-one packaging approach.