Halogen free material being in your life

Due to the increasing functionality in the consuming electronic products, now we can see them everywhere such as the cellular phone, digital camera, MP3, PDA and other else. As we knew, they have been in everybody´s life, even relying on them much more. When these products are becoming more powerful and friendly operating interface, using high reliable material with the advanced technology to enhance their design is essential. In contrast, we will make a lot of waste to increase the burden of the earth. As a result of this issue, EU has engaged the regulations like RoHS, WEEE and other relative rules in order to decrease the poisoning substance and the disposal. Flexible circuit and rigid-flex structures have seen a dramatic increase in recent years due to their popularity in hand-held device where thinness and performance are essential. The no flow prepreg for adhesive application also encounter thermal resistance, peel strength and dimension stability issue after lead free process. In this study, we try to modify the resin system and adjust the process parameters for getting better thermal and adhesive performance. We have developed halogen free material for the application in the rigid flex board. It not only has the characteristics- high Tg, high storage modulus, good heat resistance, low resin squeeze out, excellent bonding ability with different material and so on, but also meets the regulations for halogen free and lead free requirement.